The Faculty of Engineering (HKU Engineering) is delighted to join hands with Infineon Technologies, Germany’s leading semiconductor manufacturer, and signed a Memorandum of Understanding (MoU) at a ceremony held on April 16, 2025.
The MoU was signed by Professor Kaibin Huang, Head of Department of Electrical and Electronic Engineering, and Mr. David Poon, President of Infineon Technologies Greater China, witnessed by Professor David Srolovitz, Dean of HKU Engineering and Mr Tan Chee How, VP of Consumer, Computing & Communication of Infineon. The two parties aim to enhance knowledge exchange, foster collaborative research, and develop industry-focused education initiatives.
This strategic collaboration will unlock a range of opportunities, including joint initiatives, the establishment of a joint innovation centre, and the development of tailored teaching and internship programmes. By fostering synergy between academia and industry, this partnership will offer the potential of advance engineering frontiers to deliver tangible, real-world impact.
