Biomedical Innovation and Outreach Programme (B.I.O.2022), organised by the Department of Mechanical Engineering, The University of Hong Kong, had successfully been held throughout June and July. The programme aimed at exposing students to biomedical advancement in both academia and industry and establishing a platform for connection, communication, collaboration and commercialization. An international conference in hybrid mode had attracted over 150 attendees, whereas the outreach activities had served over 170 participants.
Alongside the conference, biomedical researchers were connected to the local enterprises and mentors via outreach activities, including Mentor Chat Room, Site Visit and Research Presentation Clinic. A supportive mentor-mentee network had been established to foster sustainable development for the biomedical community in Hong Kong and overseas.
For details, please visit:
https://www.mech.hku.hk/post/biomedical-innovation-and-outreach-programme-b-i-o-2022